pk461 (v1.0) march 4, 2011 100% material declaration data sheet TQG144 spartan-3an average weight: 1.2956 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die (fpga) 0.007150 0.552 silicon 7440-21-3 100.00 silicon ic 0.007150 silicon die (prom) 0.002283 0.176 silicon 7440-21-3 100.00 silicon ic 0.002283 mold compound 1.006400 77.676 silica fused 60676-86-0 87.70 filler 0.882613 epoxy resin trade secret 7.00 polymer 0.070448 phenol resin trade secret 5.00 hardener 0.050320 carbon black 1333-86-4 0.30 colouring 0.003019 die attach adhesive die to package adhesive 0.002234 0.172 silver 7440-22-4 69.50 conductive material 0.001553 epoxy resin 9003-36-5 20.00 polymer 0.000447 t-butyl phenyl glycidyl ether 3101-60-8 7.50 diluent 0.000168 phenolic resin 92-88-6 1.00 hardener 0.000022 butyl cellosolve acetate 112-07-2 1.00 solvent 0.000022 dicyandiamide 461-58-5 1.00 polymer 0.000022 die attach film die to die adhesive 0.000713 0.055 solid epoxy resin trade secret 12.50 polymer 0.000089 phenol resin trade secret 12.50 hardener 0.000089 fused silica 60676-86-0 35.00 filler 0.000250 synthetic rubber trade secret 40.00 filler 0.000285 solder plating 0.013400 1.034 tin (sn) 7440-31-5 100.00 base metal 0.013400 gold wire 0.003362 0.259 gold 7440-57-5 100.00 metallurgy 0.003362 ? copyright 2011 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are tr ademarks of xilinx in the united states and other countries. all other trademarks are the property of their respective owners pk461 (v1.0) march 4, 2011 www.xilinx.com 1
100% material declaration data sheet ? TQG1444 spartan-3an component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total lead frame 0.260100 20.075 copper (cu) 7440-50-8 94.30 base metal 0.245274 magnesium (mg) 7439-95-4 0.30 base metal 0.000780 nickel (ni) 7440-02-0 4.20 base metal 0.010924 silicon (si) 7440-21-3 1.20 0.003121 ink trace trace solvent naphtha (petroleum) 64742-94-5 trace trace 2-butoxyethanol 111-76-2 trace trace benzyl alcohol 100-51-6 trace trace bisphenol a- epichlorhydrin (reaction product) 25068-38-6 trace trace iso-butanol 78-83-1 trace trace 1,2,4- trimethylbenzene 95-63-6 trace trace solvent na trace trace formaldehyde 50-00-0 trace trace revision history the following table shows the revision history for this document. date version description of revisions 3/4/11 1.0 initial xilinx release. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test an d assembly of hardware devices to independent third-party vendors and material s suppliers (?contra ctors?). all data provided hereunder is based on inform ation received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . pk461 (v1.0) march 4, 2011 www.xilinx.com 2
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